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WELCOME TO JH Rhodes Company

Advancements in the electronics surfacing industry dictate a need for specific solutions to the many processing challenges facing today's market.

Drawing on over seventy years of polishing expertise and an in-depth knowledge of current fabrication technologies, Universal Photonics’

JH Rhodes Company has developed a product line to address specific applications in the disk, silicon wafer, and integrated circuit (IC) production processes.

 

Our commitment to the electronics surfacing industry is supported with a solid technical foundation in the physical and material sciences, and process/application engineering. Our ISO Certified factory, located in Clinton, New York, manufactures a wide variety of pads to meet the stringent requirements of the semiconductor industry.

 

Headquartered in Phoenix, Arizona, JH Rhodes Company has a wide range of high quality, cost effective consumables and the technical know-how to meet the needs of virtually all electronic surfacing and polishing disciplines.

 

PRODUCTS

 

 

No other advancement in the production of semiconductors has had as powerful an impact as chemical mechanical planarization (CMP). Combining chemical and mechanical energy, CMP is the only known process for achieving the planarity required for sub 0.5 micron devices, and meeting the requirements for sub 0.2 micron device structures and advanced interconnect schemes production.

 

 

ESM-U

 

 

Our ESM-U pad is a unique micro-cellular foamed elastomer with controlled cells designed to increase pad performance for CMP users. Its unique structure improves planarity, increases removal rate, and provides longer life on a variety of CMP applications. This product is available in a variety of standard grooving patterns and sizes - as well as custom configurations - to support all commercial CMP tools.

 

While most computer chips are manufactured on silicon substrates, certain IC’s like those used for Internet and wireless communications employ alternative substrates. Whatever the material - silicon, gallium arsenide (GaAs), germanium (Ge), etc., each requires the same critical surfacing and polishing disciplines.

 

 

ESM-57

 

 

A unique micro-cellular foamed elastomer with controlled cells, the ESM-57 has been designed for increased pad performance. ESM-57’s unique pore distribution allows lower required downforce and processing consistency, thereby improving flatness, increasing removal rate, and providing longer life in substrate applications. This product is available in a variety of standard grooving patterns and sizes - as well as custom configurations - to support all commercial polishing machines.

 

The Internet explosion has made high-speed storage a number one priority. Today the storage industry has two technologies with which to meet this priority. GMR or Giant Magneto Resistive (read-write) head technology relies on production processes and materials very similar to device wafers. The second technology rising to fill the need for high-speed storage is glass-based storage systems. Traditionally disk drives have stored information on rigid nickel-plated aluminum disks. Glass outperforms nickel disks in that it has better surface characteristics and dimensional stability. Glass disk technology is making its debut in commercial applications where its additional performance benefits are needed.

 

 

ESM-013

 

 

ESM-013’s unique micro-cellular structure enables it to act in a “sponge-like” manner while maintaining the hardness and flatness necessary in critical surface preparations. This product is available in a variety of standard grooving patterns and sizes - as well as custom configurations - to support all commercial CMP tools.

 

 

UNI-NAP 13

 

 

Uni-Nap is an intrinsic napped poromeric material with uniform pore structure and high pore wall strength. Its consistent, uniform pore size, excellent surface finish and long life are the results of tightly controlled manufacturing parameters ideal for final polishing processes. This product is available in a variety of grooving patterns and sizes - as well as custom configurations.

 

 

PRODUCT CONFIGURATIONS

 

 

FULL PADS Available up to 65 inches

SEGMENTED PADS Diameters larger than 66 inches

GROOVING Available in variety of grooving patterns

 

For further information please use the contact page or call 480.346.7064.

JH Rhodes Corporate Headquarters
4809 East Thistle Landing Drive, Suite 100
Phoenix, Arizona 85044

   

 

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